Sub-THz Antenna Front-End Technology Development

The advancement of semiconductor technology reaching higher oscillation frequency (fmax) in the terahertz range, has allowed the spread of transmitters and receivers at the sub-terahertz bands (>100GHz) band, using CMOS, SiGe, InP, GaAs... At these frequencies, the packaging strategy is crucial due to the limited SNR obtained with these circuits. It is quite common to see antenna on-package integration at these frequencies since the physical size of antennas is still relatively large and therefore costly to manufacture within the same circuit. Moreover, there is still the need to combine multiple-chip technologies within the same package. All in all, realizing a multi-chip package at sub-terahertz frequencies (>100GHz) that can provide seamless integration with the antenna with low loss and takes into account other aspects such as the thermals and cost, remains a challenge.

Master thesis project:

•  Design of antenna arrays using novel packaging technologies at sub-THz

•  Development of lenses, antennas and interconnects on new integration technologies and materials at sub-THz frequencies

Supervisory team: Maria Alonso-Del Pino, Cesare Tadolini, Paolo Sberna

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Last modified: 2025-11-28